News & Events
PACK EXPO International 2014
Visit us at Booth #E-8309
Fort Dearborn Company will be displaying our latest label innovations at the upcoming Pack Expo International in Chicago, IL from November 2-5, 2014.
Our booth will feature a variety of shrink sleeve, pressure sensitive, roll-fed and cut & stack label samples. Stop by to see our latest innovations and to discuss your package decorating needs.
Innovations on Display Including:
– Wood Veneer Pressure Sensitive Labels
– Insulating Labels (Foam)
– High Shrink Roll-Fed Labels
– Specialty Effects Inks & Coatings
Click here to register for the show.